The process in which polyolefin and polyamide materials are primarily used was designed to environmentally protect and encapsulate electronic components such as circuit boards. They were made to defend the pieces from vibration, dirt, dust, and moisture. This procedure was also used to strain reliefs, mold grommets, and seal connectors.
The elements including a raw material and specialized molding device are the primary supplies which are incorporated in this method. A low pressure molding process makes use of a polyamide or dimer acid based material which can give form to different compounds. The procedure referred as an innovative manufacturing method would require molding and potting injections to be integrated to inject a hot melt adhesive secured in a low pressure.
This form of application is an inexpensive substitute for epoxy setting that ensures they protect the numerous delicate pieces. Their application in connector or cable moldings can effectively tension reliefs compared to the traditional plastic injections. They have the capability to offer accomplished seals for the elements which ensure tight water encapsulation, and to effectively strain reliefs.
Low viscosity gave them the opportunity to inject the material placed in a low pressure which keeps a wire and piece away from dislocation and harm. An easy encapsulation of a fragile element is attained to safeguard them from the fumes caused by their processing and materials. A conventional method primarily starts by giving the cases a shape, and then afterwards, is palletized.
The insertion of the electronic components and preheating them follows subsequently. After the preheating procedure, they are encapsulated, settled, and vacuumed, and testing and curing them comes last. The low pressure method flow is completed by inserting the pieces followed by their over molding, and testing them comes after.
The entire concept which governs over molding procedures is that they have the capability to replace potting or housing processes with a single practice. It is in this method that sealing huge PC boards with the usage of external connectors is primarily used before encasing them. The encapsulation process of the delicate elements is carried out before the traditional ones are.
Over molding different figures is recommended, and placing a high performance and sensitive piece is next. A molded tension relief and grommet, sealed wire, and utilization of tension relief are the fundamentals which allow you to obtain strain reliefs. In addition, the method which concentrates on sealing a micro switch is next practice to the fundamentals.
This procedure is created by Henkel Corporation which was located in Europe, and experiments about the usage of hot melt supplies to primarily seal connectors or create tension relief for numerous wires was conducted. But, the automotive industry was responsible for their commercial release. They were concerned on replacing toxic and oppressive potting methods with lighter and safer ones.
Ever since then, this method has been applied in various areas such as wire harness, military, consumer, medical, industrial products, and other items that require sealing processes, and the protection against the environment. Likewise, they could also be applied in various outputs such as control boards, moisture sensors, RFID tags, and USB thumb drive. Simply, if sealing methods and protection is needed, this process is the excellent solution.
The elements including a raw material and specialized molding device are the primary supplies which are incorporated in this method. A low pressure molding process makes use of a polyamide or dimer acid based material which can give form to different compounds. The procedure referred as an innovative manufacturing method would require molding and potting injections to be integrated to inject a hot melt adhesive secured in a low pressure.
This form of application is an inexpensive substitute for epoxy setting that ensures they protect the numerous delicate pieces. Their application in connector or cable moldings can effectively tension reliefs compared to the traditional plastic injections. They have the capability to offer accomplished seals for the elements which ensure tight water encapsulation, and to effectively strain reliefs.
Low viscosity gave them the opportunity to inject the material placed in a low pressure which keeps a wire and piece away from dislocation and harm. An easy encapsulation of a fragile element is attained to safeguard them from the fumes caused by their processing and materials. A conventional method primarily starts by giving the cases a shape, and then afterwards, is palletized.
The insertion of the electronic components and preheating them follows subsequently. After the preheating procedure, they are encapsulated, settled, and vacuumed, and testing and curing them comes last. The low pressure method flow is completed by inserting the pieces followed by their over molding, and testing them comes after.
The entire concept which governs over molding procedures is that they have the capability to replace potting or housing processes with a single practice. It is in this method that sealing huge PC boards with the usage of external connectors is primarily used before encasing them. The encapsulation process of the delicate elements is carried out before the traditional ones are.
Over molding different figures is recommended, and placing a high performance and sensitive piece is next. A molded tension relief and grommet, sealed wire, and utilization of tension relief are the fundamentals which allow you to obtain strain reliefs. In addition, the method which concentrates on sealing a micro switch is next practice to the fundamentals.
This procedure is created by Henkel Corporation which was located in Europe, and experiments about the usage of hot melt supplies to primarily seal connectors or create tension relief for numerous wires was conducted. But, the automotive industry was responsible for their commercial release. They were concerned on replacing toxic and oppressive potting methods with lighter and safer ones.
Ever since then, this method has been applied in various areas such as wire harness, military, consumer, medical, industrial products, and other items that require sealing processes, and the protection against the environment. Likewise, they could also be applied in various outputs such as control boards, moisture sensors, RFID tags, and USB thumb drive. Simply, if sealing methods and protection is needed, this process is the excellent solution.
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